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AI Connector

MCIO Paddle-less

Designed with space optimization and signal performance in mind, AIOTEK MCIO paddle-less connectors offer a compact board-to-cable interface for high-speed I/O applications. The paddle-less structure enhances mechanical robustness while supporting next-generation PCIe data rates in dense system layouts.

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Key Features

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Low Impedance Variation

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High-Speed Signal Transmission

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Low Material Sensitivity

Precision Dimensional Control

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High Manufacturing Compatibility

Seamless Replacement

Product Description

  • This product features a breakthrough paddle-less architecture, delivering a next-generation signal transmission solution for AI servers and high-performance computing (HPC) systems, surpassing the limitations of conventional paddle card (PCB) designs.
  • By eliminating the traditional PCB and adopting precision terminal insert molding technology, it achieves exceptional dimensional accuracy and impedance stability unattainable with legacy manufacturing processes.
  • Fully compliant with SFF-TA-1016 industry standards and PCIe Gen6 specifications, the solution supports data rates of up to 64 GT/s. As a true drop-in replacement for conventional paddle cards, it enables seamless adoption without changes to existing mechanical designs or cable assemblies, delivering superior signal integrity (SI) and assembly yield with minimal transition cost.
  • The primary high-volume production configuration is 74 pins (8X + sidebands), optimized to meet the demands of today’s high-density computing architectures.

 

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Benefits

  • Low Impedance Variation:Impedance variation controlled within ±4 Ω, with measured stability maintained between 83–91 Ω.
  • High-Speed Signal Transmission:Fully supports 64 GT/s data rates. Insertion Loss, Return Loss, Near-End Crosstalk (NEXT), and Far-End Crosstalk (FEXT) all comply with PCIe® 6.0 specifications.
  • Low Material Sensitivity:The majority of the contact center is embedded within the plastic housing, significantly minimizing impedance impact caused by housing and insert material variations.
  • Precision Dimensional Control:Profile and thickness tolerances tightly controlled within ±0.05 mm.
  • High Manufacturing Compatibility:Compatible with both Hotbar bonding and Micro Resistance Welding processes. Existing Hotbar equipment can be used for rapid production, while Micro Resistance Welding offers enhanced process stability—no additional equipment investment required.
  • Seamless Replacement:Enables direct replacement of existing Paddle Card (PCB) designs without mechanical redesign or cable modification.

 

 

Product Specification

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Specification Internal Cable SPEC., PCIe Gen6
Description Straight Exit , 74 Pin ,8X+sidebands
Plating Contact Area : 30u” Au; Solder Area : 0.5u” Au
Host Board Thickness 1.57mm
Data Rate 64GT/S/Lane, PCIe Gen6
Voltage Rating 30V/Pin
Current Rating 1.0A/Pin (Max)
Impedance 85Ω
Application AI Server
Cable connection process Hot Bar process
wire gauge 30AWG
Solder PAD width Signal: 0.35mm / Drain wire: 0.38mm
Pair-to-pair pitch 1.90mm

 

 

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