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AI Connector

GEN Z

Developed to address the growing need for composable and disaggregated architectures, AIOTEK Gen Z connectors support next-generation memory-centric and fabric-based computing. With protocol-agnostic capability and scalable lane configurations, these connectors provide a flexible foundation for high-bandwidth, low-latency system design.

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Key Features

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Low Impedance Variability

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High-Speed Signal Transmission

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Precision Dimensional Control

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Low Latency Performance

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Superior Signal Integrity

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Low-Halogen Material Construction

Product Description

  • Terminal Material: High-conductivity copper alloy
  • Contact Area Plating: Gold
  • Solder Area Plating: Tin
  • Flammability Rating: UL 94V-0
  • Maximum Contact Resistance Change After Environmental Exposure: 10 mΩ
  • Minimum Rated Current per Contact: 1.1 A
  • Durability: Minimum 50 mating cycles
  • Maximum Insertion Force per Contact Pair (AIC): 1.1 N
  • Minimum Withdrawal Force per Contact Pair (AIC): 0.1 N

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Benefits

  • Low Impedance Variation: Impedance variation within ±4Ω; measured impedance tightly controlled between 83–91Ω.
  • High-Speed Transmission: Supports data rates up to 32 GT/s. Insertion Loss, Return Loss, Near-End Crosstalk (NEXT), and Far-End • • • Crosstalk (FEXT) fully comply with PCIe 5.0 specifications.
  • Precision Dimensional Control: Tolerances accurately maintained within ±0.05 mm.
  • Low Latency: Optimized for high-performance computing, including machine learning, simulation, deep learning, and cloud services.
  • Excellent Signal Integrity: Delivers enhanced power to SSDs, enabling superior performance.
  • Low-Halogen Material Construction: Fully compliant with RoHS standards.

 

 

Product Specification

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Specification SFF-TA-1002 SFF-TA-1002 SFF-TA-1002 SFF-TA-1002
Description Receptacle Straddle Mount, 56 Pin Receptacle Straddle Mount, 84Pin Receptacle Straddle Mount, 140 Pin Receptacle Straddle Mount, 168 Pin
Plating Contact Area : 30u" Au / 15u" Au (option)
Solder Area : Tin		 Contact Area : 30u" Au / 15u" Au (option)
Solder Area : Tin		 Contact Area : 30u" Au / 15u" Au (option)
Solder Area : Tin		 Contact Area : 30u" Au / 15u" Au (option)
Solder Area : Tin
AIC Thickness 1.57mm 1.57mm 1.57mm 1.57mm
PC Board Thickness 1.57mm 1.57mm 1.57mm 1.57mm
Data Rate 32GT/S/Lane, PCIe Gen5 32GT/S/Lane, PCIe Gen5 32GT/S/Lane, PCIe Gen5 32GT/S/Lane, PCIe Gen5
Voltage Rating 29V/Pin 29V/Pin 29V/Pin 29V/Pin
Current Rating 0.8A/Pin (Max) 0.6A/Pin (Max) 0.5A/Pin (Max) 0.5A/Pin (Max)
Impedance 85Ω 85Ω 85Ω 85Ω
Application AI Server AI Server AI Server AI Server
Connection process SMT process SMT process SMT process SMT process